Company Profile

Amkor Technology

Company Overview

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.

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  • 1 month, 4 days ago

    Director, fcCSP Business Unit

    Amkor Technology - Tempe, AZ, United States
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    Position Summary:Amkor is seeking a Product Engineer/Manager preferably with experience in IC package development / business acumen, with an emphasis on fcCSP technologies across the various package types (high performance computing, Grade 0, 1, 2 Grade 3 Automotive for autonomous driving and cabin infotainment.) These are advanced flip-chip packages with leading edge thermal / mechanical / electrical requirments. This position will manage the product development, business strategy, pricing/cost ...

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  • 1 month, 4 days ago

    Director, Package Developement

    Amkor Technology - Tempe, AZ, United States
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    Position Summary:Amkor is seeking a senior Director of Advanced Packaging and Wafer Services for the Tempe, AZ office. This role will provide strategic and technical leadership for the development and commercialization of advanced wafer-based IC package platforms, including HDFO, 2.5D, chiplet-based architectures, and other leading-edge package constructions for computing, networking, AI, and mobile market segments. The successful candidate will serve as a senior customer-facing leader and ...

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  • 1 month, 27 days ago

    Director, Chiplets/FCBGA Integration

    Amkor Technology - Tempe, AZ, United States
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    Position Summary:Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based IC Packages including HDFO (High Density Fan-out) and other advanced IC Package constructions for Computing, Networking and Mobile market spaces. This person will be the primary interface with Tier 1 customers and Amkor's leading edge R D center in South Korea. Essential Duties and Responsibilities:Drive ...

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